Chinese electronics manufacturer Oppo teased its camera-focused smartphones called R9 and R9 Plus in February. Only a few specs of the handset were revealed at that time. Earlier this month, both the smartphones sailed through TENAA certification in China thus disclosing most of their specifications. Now the complete specs of the devices have leaked, before the formal launch on March 17th.
TENAA certification indicated octa-core SoC’s for both the devices, however the latest leak has disclosed that the R9 Plus will feature octa-core Snapdragon 652 chipset instead of Snapdragon 810 processor as speculated earlier. In addition, the R9 is also expected to be driven by the same SoC.
Oppo R9 is rumored to come with a full HD AMOLED 5.5-inch display with 1080×1920p screen resolution. The handset is expected to pack in 4GB of RAM along with expandable 32GB internal storage on board. In terms of camera, Oppo R9 is said to embrace LED-supported 16MP rear snapper along with 13MP front-facing selfie camera. The device will also encompass Hybrid Dual SIM support, fingerprint scanner, 4G LTE connectivity and will be powered by 2850mAh battery backup with VOOC Rapid Charge technology.
Oppo R9 Plus, on the other hand, is speculated to feature full HD AMOLED 6-inch display with 1080×1920p screen resolution. The device is said to sport 4GB of RAM and 64GB/128GB expandable internal storage and to be driven by Android 5.1.1 Lollipop out of the box.
For camera, the R9 Plus is expected to come with LED-supported 16MP back snapper along with 16MP selfie shooter. Other specs include 4G LTE connectivity, Hybrid dual SIM support, 4120mAh battery backup and fingerprint sensor.
The devices are expected to come in two color options including Gold and Rose Gold. The official launch is scheduled for 17th March in Beijing.